บุคลากร(สายวิชาการ)

  • ประวัติการศึกษา
  • ผลงานการวิจัย
  • เอกสารประกอบการเรียนการสอน

ประวัติการศึกษา

ปริญญาตรี

วศ.บ. วิศวกรรมไฟฟ้าสื่อสารและอิเล็กทรอนิกส์ (เกียรตินิยมอันดับ 1)

มหาวิทยาลัยพระจอมเกล้าธนบุรี

ปีที่จบการศึกษา 2557

 

ปริญญาโท

วศ.ม. วิศวกรรมไฟฟ้า

มหาวิทยาลัยพระจอมเกล้าธนบุรี

ปีที่จบการศึกษา 2560

 

ปริญญาโท

M.Eng. in Electrical Engineering and Computer Science

Shibaura Institute of Technology, Tokyo, Japan

2017

 

ปริญญาเอก

Ph.D. in division of Functional Control Systems

(in the field of Electrical and Computer Engineering)

Shibaura Institute of Technology, Tokyo, Japan

2020

ผลงานการวิจัย


วารสารระดับนานาชาติ

[1] P. Gomasang, S. Nakajima, and K. Ueno (2021) “Nitrogen-doped amorphous carbon coating on copper pads for direct wire bonding with a long-term humidity reliability.” Japanese Journal of Applied Physics 60, SCCD03, 2021.

[2] T. Murota, T. Mimura, P. Gomasang, S. Yokogawa, and K. Ueno (2020) “Humidity reliability of commercial flash memories for long-term storage.” Japanese Journal of Applied Physics 59, SLLC01, 2020.


ประชุมวิชาการระดับนานาชาติ

[1] T. Murota, T. Mimura, P. Gomasang, S. Yokogawa, and K. Ueno, “Humidity reliability of commercial flash memories for long-term storage,” Jpn. J. Appl. Phys. 59, SLLC01 (2020).

[2] P. Gomasang, K. Kawahara, K. Yasuraoka, M. Maruyama, H. Ago, S. Okada, and K. Ueno, “A Novel Graphene Barrier against Moisture by Multiple Stacking Large-grain Graphene,” Sci. Rep. 9, 3777 (2019).

[3] P. Gomasang, S. Ogiue, S. Yokogawa, and K. Ueno, “Lifetime prediction model of Cu-based metallization against moisture under temperature and humidity accelerations,” Jpn. J. Appl. Phys. 58, SBBC01 (2019).

[4] P. Gomasang, T. Abe, K. Kawahara, Y. Wasai, N. Nabatova-Gabain, N. T. Cuong, H. Ago, S. Okada, and K. Ueno, “Moisture Barrier Properties of Single-Layer Graphene Deposited on Cu Films for Cu Metallization,” Jpn. J. Appl. Phys. 57, 04FC08 (2018).

[5] P. Gomasang, T. Murota, and K. Ueno “Moisture barrier properties of nitrogen-doped amorphous-carbon coating on Cu film surface” 7th Green Innovation Symposium, Tokyo, February 2020, p. 163.

[6] P. Gomasang and K. Ueno “Amorphous-carbon barrier against moisture for Cu metallization,” The 80th JSAP autumn meeting, Sapporo, September 2019, p. 15-116.

[7] P. Gomasang, K. Kawahara, H. Ago, and K. Ueno, “The improved moisture barrier of graphene coating on Cu film surface,” Tokyo, 6th Green Innovation Symposium, February 2019, p. 95.

[8] P. Gomasang, S. Ogiue, S. Yokogawa, and K. Ueno, “Lifetime prediction of humidity resistance on Cu-based metallization for long-term storage,” Tokyo, ADMETA satellite workshop, November 2018, p. 66.

[9] P. Gomasang, Tomoki Murota, and K. Ueno, “Nitrogen-Doped Amorphous-Carbon as Efficient Moisture Barrier on Copper,” Advanced Metallization (ADMETA) Conference, October 2019, p. 100.

[10] T. Murota, T. Mimura, P. Gomasang, S. Yokogawa, and K. Ueno, “Humidity reliability of commercial flash memories for long-term storage,” Ext. Abstr. Advanced Metallization (ADMETA) Conference, Tokyo, Japan, October 2019, p. 86.

[11] P. Gomasang and K. Ueno, “Amorphous-Carbon Barrier against Moisture for Copper Metallization and Effects of CF4 Plasma Treatment,” International Conference on Solid State Devices and Materials (SSDM), September 2019, p. 86.

[12] P. Gomasang, K. Kawahara, H. Ago, and K. Ueno, “Stacked Graphene Layers for Efficient Moisture Barrier in Cu Metallization,” Advanced Metallization (ADMETA) Conference, October 2018, p. 717.

[13] P. Gomasang, S. Ogiue, S. Yokogawa, and K. Ueno, “Temperature and Humidity Accelerations to Establish Lifetime Prediction Model for Cu-based Metallization,” International Conference on Solid State Devices and Materials (SSDM), September 2018, p. 447.

[14] P. Gomasang, S. Ogiue, S. Yokogawa, and K. Ueno, “Oxidation Structure Change of Copper Surface Depending on Accelerated Humidity,” IEEE International Interconnect Technology Conference (IITC), June 2018, p. 112.

[15] P. Gomasang, T. Abe, S. Ogiue, H. Ura, S. Yokogawa, and K. Ueno, “High Temperature and High Humidity Accelerations to Estimate the Lifetime of Cu Metallization for LSIs,” The 13th International Conference on Ecomaterials (ICEM), November 2017, p. 90.

[16] P. Gomasang, K. Kawahara, H. Ago, and K. Ueno, “Moisture Barrier Properties of Single-Layer and Double-layer Graphene on Cu Film,” Advanced Metallization (ADMETA) Conference, October 2017, p. 124.

[17] P. Gomasang, T. Abe, K. Kawahara, Y. Wasai, N. Nabatova-Gabain, N. T. Cuong, H. Ago, S. Okada, and K. Ueno, “Moisture Barrier Properties of Single-Layer Graphene Deposited on Cu Films for Cu Metallization,” International Conference on Solid State Devices and Materials (SSDM), September 2017, p. 355.

[19] P. Gomasang and R. Silapunt, “The Effects of Stray Field in Difference of Bit Patterns Exposure on Read Head Performance,” 13th South East Asian Technical University Consortium Symposium (SEATUC), ISSN 1882- 5796, February 2016.

[20] P. Gomasang, P. Sangwan, and C. Wongviriyawong, “Assessing Interpersonal Relationship among Peers in a Constructionist Classroom: a Probabilistic Method,” Constructionism in Action: Conf. Proc. ISBN (E-Book) 978-616-92726-0-1, February 2016, p. 8.

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